Huawei, Harbin Institute of Technology jointly issued diamond chip patent, cultivate diamonds rose 16%

Release time:

2023-12-14

On November 21, according to the enterprise investigation, recently, Huawei Technology Co., Ltd. and Harbin Institute of Technology applied"A hybrid bonding method for three-dimensional integrated chips based on silicon and diamond"Patent Publication.

 

The patent summary shows that the present invention relates.chip manufacturing technologyField.

The method includes: preparing silicon-based Cu/SiO2 mixed bonding samples and diamond-based Cu/SiO2 mixed bonding samples for plasma activation treatment;

 

A hydrofluoric acid solution is dropped on the surface of the silicon-based and/or diamond-based Cu/SiO2 hybrid bonding sample to be bonded after blow-drying, and the silicon-based and diamond-based Cu/SiO2 hybrid bonding samples are aligned and bonded for pre-bonding to obtain a pre-bonding chip; the pre-bonding chip is hot-press bonded and annealed to obtain a hybrid bonding sample pair.

 

The invention realizes the three-dimensional heterogeneous integration of silicon/diamond based on Cu/SiO2 hybrid bonding. It is reported that the patent was applied for publication on October 27, 2023.Affected by this, the concept of cultivating diamonds has increased by more than 16%.

A hybrid bonding method for three-dimensional integrated chips based on silicon and diamond

1

Preparation of silicon-based Cu/SiO hybrid bonding samples and diamond-based Cu/SiO hybrid bonding samples;

2

plasma activation treatment of the silicon-based Cu/SiO hybrid bonding sample and the diamond-based Cu/SiO hybrid bonding sample respectively;

3

The silicon-based Cu/SiO mixed bonding sample and the diamond-based Cu/SiO mixed bonding sample after plasma activation treatment are soaked in an organic acid solution, the organic acid wet activation is carried out, and the cleaning is dried;

4

dropping hydrofluoric acid solution on the surface to be bonded of the silicon-based Cu/SiO mixed bonding sample and/or the diamond-based Cu/SiO mixed bonding sample after blow-drying, and pre-bonding the silicon-based Cu/SiO mixed bonding sample and the diamond-based Cu/SiO mixed bonding sample in alignment and fitting to obtain a pre-bonding chip;

5

The pre-bonding chip is subjected to thermal pressure bonding and annealing treatment to obtain a hybrid bonding sample pair.

Focus on hot spots

Application Prospect of Diamond in Aerospace Field

The main application of diamond powder

As a kind of super hard abrasive, diamond powder has incomparably superior grinding ability, which has been paid more and more attention by the industrial developed countries. The grinding ability of diamond powder includes the grinding ability of the workpiece and its own wear resistance and crushing resistance, depending on its microhardness, particle size, strength, particle size, and thermal and chemical stability. To sum up, diamond powder used as abrasive has three aspects; (1) Used in the manufacture of resin-bonded tools, metal-bonded tools, and plating tools. (2) for industrial, scientific and medical precision or polishing of various precision components. (3) as a fine abrasive for mold processing, gem polishing processing, gem bearing processing and manufacturing. In addition to the application of diamond powder as a grinding material, another major use is used as a functional material. For example, the use of its thermal properties and electrical properties. By mixing diamond fine powder into thermosetting resin polymer, cellulose, phenolic resin or ceramic sheet, a new material having improved thermal conductivity and reduced thermal expansion can be produced. The diamond powder mixed to the metal sheet, such as sheet or stainless steel sheet can be made with high thermal conductivity, low thermal expansion and light weight of the new sheet material, in the electronics industry can be made into high-density high-energy devices for thermal control. From the form of diamond used as grinding materials, according to the relevant data published figures, the world's industrial consumption of more than 60% of diamond powder is used to make diamond plaster, diamond powder mixture and diamond powder grinding fluid.

Ultra-precision polishing of precision instruments for the use of nanodiamonds

We add nano-diamond to the medium to make nano-diamond polishing liquid, which is now mainly divided into aqueous polishing liquid and oily polishing liquid. Because the nano-diamond polishing liquid nano-diamond particles super hard super hard, with it can remove the material surface small uneven, polished material surface roughness can be reduced to nano-level, so that the material surface finish is very high. At present, nano-diamond polishing liquid can be used in semiconductor silicon wafer polishing, computer head polishing, precision ceramic processing, gem polishing, optical glass polishing and other fields. Nowadays, due to the development of computers, people's requirements for computer storage capacity continue to increase, which makes us want to manufacture larger disks. In recent years, the storage capacity of computer disks has been increasing, but with the increase of storage capacity, the problem is that the gap between the disk and the head is getting smaller and smaller, which is close to 10NM. The surface roughness, scratches and impurity particles of the head and the disk will cause damage to the computer disk. As the distance between the disk and the head has reached the nanometer level, the micron-level polishing liquid has failed to meet the polishing requirements, so only nano diamond polishing liquid can meet the requirements of this aspect. We used nano-diamond polishing liquid to polish the computer magnetic head, and found that the surface smoothness of the magnetic head was greatly improved after polishing. The measured surface roughness at this time was 0.09~0.40nm, while the surface roughness of the magnetic head was 0.45~0.80nm after polishing with ordinary polishing liquid. Compared with nano-diamond polishing liquid, the effect of nano-diamond polishing liquid is much better, thus the quality of the computer magnetic head is also improved, and we can produce more precision, A computer disk with a larger storage capacity. It is worth noting that when polishing, because the computer and other electronic products most avoid corrosion, so be sure to control the pH of the polishing liquid, the study found that the PH value of the polishing liquid is more appropriate to control between 6.5 and 8. Since the content of anions Cl-and SO2-will determine the pH of the polishing solution, the content of Cl-and SO2-should be controlled when preparing the polishing solution for computer head polishing, and the PH value should be observed at the same time.

Characteristics of Shandong Metal Powder Hydraulic Press

Shandong metal powder hydraulic press is suitable for automatic control molding of powder dry pressing. It is widely used in electronics, powder metallurgy, soft magnetic industry, conductive dry pressing molding, chemical industry, automobile manufacturing, medicine, energy and environmental protection industry, toy industry, etc. Suitable dry-pressed powders include ferrous and non-ferrous metal powders, electronic ceramic powders, ferrites, rare earth powders, cemented carbide powders, PTFE, diamond and graphite powders, and the like. The hydraulic transmission system of Shandong metal powder hydraulic press is composed of power mechanism, control mechanism, actuator, auxiliary mechanism and working medium. The power mechanism usually uses an oil pump as the power mechanism, and is generally an integrated oil pump. One or more oil pumps are selected in order to meet the speed of movement of the actuator. Low pressure gear pump; medium pressure vane pump; high pressure piston pump. The pressure processing and forming of various plastic materials, such as the extrusion, bending, drawing of stainless steel plates and steel plates, and the cold pressing of metal parts, can also be used for the pressing of powder products, grinding wheels, bakelite and resin thermosetting products.

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